珠海电路板定做工艺能力范围:
最小板厚&公差范围:0.2mm+0.08mm、喷锡板: 0.2mm土20% ( 8mil+0% ):
最小线宽/线隙&公差范围:金板: 0.075mm+ 20% (3mil+0%)
铜皮距板边:0.5mm (20mi)
孔边距线边:0.3mm (12mil)
最小孔径&公差范围:0.2mm土.076mm (8mil+3mil)
最小孔距&公差范围:0.4mm土.076mm (16mil+3mil)
孔内铜厚:20 -25um (0.79mil- 1.0mil)
孔定位偏差:+0.076mm (|土3mil)
最小冲圆孔直径:FR 4板厚1.0mm(40mi)以下: 1.0mm(40mi)